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OCP solutions
Open Compute - India's Official Partner
Leading the Open Compute Revolution. Empowering data centers with open, cost-efficient, and high-density solutions built for the future.
ORV3 Rack -
Direct-to-Chip Cooling Ready
The TierX ORV3 Rack is engineered to meet the demanding thermal and power requirements of next-generation AI, HPC, and cloud workloads. Built on the Open Rack V3 (ORV3) standard and integrated with a ready-to-use DTC, it delivers unmatched thermal performance for high-density compute environments.​
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In Accordance with OCP ORV3 Standards
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11OU Size Rack for Lab applications
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44OU for Cloud and Hyperscale data centers
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Suitable for all the liquid cooling solutions
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Customizable and Scalable
Bus Bar - OCP ORV3
The TierX OCP ORV3 Bus Bar is engineered to deliver reliable, scalable, and high-current power distribution for modern AI, HPC, and cloud data center environments. Built to full Open Rack V3 (ORV3) compliance, it ensures seamless interoperability with OCP-based racks, power shelves, and high-density compute nodes.​
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In Accordance with OCP ORV3 Design
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In-house design and development
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30KW -100KW Busbar based on application
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Air Cooled Bus bar
